CN/EN

产品与市场

WLM1

特点

●  无铅兼容无卤材料

●  高Tg材料:180℃ (DMA)

●  白色LED用可见光高反射率材料

●  热处理和光线照射后不变色

应用领域

适用于LED,COB,封装材料,mini LED等

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Items Condition Unit Typical Value
Whiteness Internal Standard %
88
Tg
DMA

181
Td 5% wt. loss 374
T288
TMA min >60
T260 TMA min
>60
Thermal Stress
288℃, solder dip
- Pass
CTE (Z-axis) Before Tg ppm/℃ 26.8
After Tg ppm/℃ 123.7
50-260℃ % 1.9
CTE (X/Y-axis)
Wrap-α1
ppm/℃
11-13
Fill--α1
ppm/℃
11-13
Arc Resistance D-48/50+D-0.5/23 s 180
Dielectric Breakdown D-48/50+D-0.5/23 kV 45+kV NB
Peel Strength (1Oz) 288℃/10s N/mm 0.93
Flexural Strength (LW/CW) A MPa 480/370
Water Absorption E-1/105+D-24/23 % 0.08
Flammability
C-48/23/50
Rating
HB

Remarks:

1。 Specimen thickness: 1。0mm。 Test method is according to IPC TM-650。

2。 All the typical values listed above are for your reference only and not intended for specification。 Please contact Shengyi Technology Co。, Ltd。 for detailed information。 All rights from this data sheet are reserved by Shengyi Technology Co。, Ltd。

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity。