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SF202C

特点

●  优异的耐离子迁移特性。

●  优异的耐热老化性。

●  阻燃性达到UL94 VTM-0级。

●  高频下较低的介电常数、介质损耗角正切。

●  溢胶量低,加工性好,适于快速压合和传统压合。

●  满足RoHS指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。

应用领域

汽车等对安全性、可靠性,要求较高的电子产品。

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Items Method Condition Unit Typical Value
Peel Strength (90°)* IPC-TM-650 2.4.9D Accepted N/mm 1.2
288℃, 5s 1.2
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability SY Method
After peeling off the paper
% 0.0270/0.0030
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >90
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 8×108
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
2×105
Dielectric Constant (10GHz) SPDR C-24/23/50 - 3.2
Dissipation Factor (10GHz) SPDR C-24/23/50
- 0.008
Resin Flow IPC-TM-650 2.3.17.1 180℃/10+60s,100kg/cm2
mm <0.15
Flammability UL94 E-24/125
Rating V-0

Remarks:

*Testing after laminating with shining side of copper foil in suitablecondition

1.Certified to IPC-4203/21 Poyimide dielectric withpolyimide adhesive

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.