●  低介电常数,低传输损耗。

●  优秀的耐热性、尺寸稳定性、耐化学性及电性能。

●  不含卤素,阻燃性达到UL94 VTM-0级。

●  满足RoHS指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。


手机天线、微波通信、高速网络设备、传感器、 高频电路基板等。
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Items Method Condition Unit Typical Value
Peel Strength (90°) IPC-TM-650 2.4.9D Accepted N/mm 1.0
288℃, 5s 1.0
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability IPC-TM-650 2.2.4B After Etched
% -0.0391/-0.0512
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % 97
Electric Strength IPC-TM-650 D-48/50+D-0.5/23 KV/mm 159
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 1.5×109
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
Dielectric Constant (10GHz) SPDR C-24/23/50 - 2.9
Dissipation Factor (10GHz) SPDR C-24/23/50
- 0.002
Folding Endurance JIS C-6471 R0.8×4.9N
Times >400
Flammability UL94 E-24/125 Rating VTM-0


1.Certified to IPC-4204/24 Copper Clad Liquid CrystalPolymer Adhesiveless

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

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