CN/EN

产品与市场

SF230

特点

●  较低的介电损耗,插损接近LCP。

●  优秀的耐热性、尺寸稳定性、耐化学性及电性能。

●  不含卤素,阻燃性达到UL94 VTM-0级。

●  满足RoHS指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。

应用领域

高速电路用挠性印制板和刚挠性印制板
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Items Method Condition Unit Typical Value
Peel Strength (90°) IPC-TM-650 2.4.9D Accepted N/mm 1.36
288℃, 5s 1.47
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability IPC-TM-650 2.2.4B After Etched
% 0.0149/-0.0360
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >95
Electric Strength IPC-TM-650 2.5.6.2A D-48/50+D-0.5/23 KV/mm 200
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 1.2×109
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
4.5×106
Dielectric Constant (10GHz) SPDR C-24/23/50 - 3.2
Dissipation Factor (10GHz) SPDR C-24/23/50
- 0.005
Folding Endurance JIS C-6471 R0.8×4.9N
Times >200
Flammability UL94 E-24/125 Rating VTM-0

Remarks:

1.Certified to IPC-4204/25 Copper Clad Liquid Crystal Polymer Adhesiveless

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.