CN/EN

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SF305C

特点

●  不含卤素,阻燃性达到UL94 V-0级。

●  粘结强度高,尺寸稳定性、耐热性好。

●  溢胶量低,加工性好,适于快速压合和传统压合。

●  满足RoHS指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等

应用领域

 挠性印制电路板用覆盖膜
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Items Method Condition Unit Typical Value
Peel Strength (90°)* IPC-TM-650 2.4.9D Accepted N/mm 1.05
288℃, 5s 1.07
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability SY Method After peeling off the paper
% 0.0158/0.0404
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >90
Electric Strength IPC-TM-650 2.5.6.2A D-48/50+D-0.5/23 KV/mm 110
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 4.8×108
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
1.2×106
Dielectric Constant (10GHz) SPDR C-24/23/50 - 3.3
Dissipation Factor (10GHz) SPDR C-24/23/50
- 0.017
Resin Flow IPC-TM-650 2.3.17.1 180℃/10+60s,100kg/cm2
mm <0.15
Flammability UL94 E-24/125 Rating V-0

Remarks:

*Testing after laminating with shining side of copper foil in suitablecondition

1.Certified to IPC-4203/2 Epoxy adhesive on one or twosides of poyimide dielectric

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.